Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-11-08
2005-11-08
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C029S846000
Reexamination Certificate
active
06962866
ABSTRACT:
The present invention is directed to a high-performance system on a chip which uses multi-layer wiring/insulation through-hole interconnections to provide short wiring and controlled low-impedance wiring including ground planes and power supply distribution planes between chips.
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Ahn Kie Y.
Forbes Leonard
Chambliss Alonzo
Dickstein , Shapiro, Morin & Oshinsky, LLP
Micro)n Technology, Inc.
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