Method of wafer level chip scale packaging

Details Method of wafer level chip scale packaging Method of wafer level chip scale packaging

2005-09-06

2005-09-06

Pham, Hoai (Department: 2814)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000

Reexamination Certificate

active

06939789

ABSTRACT:
The invention includes a method of wafer level chip scale packaging including providing a semiconductor device having a silicon based substrate with discrete devices defined therein and a contact pad near an upper surface thereof, a passivation layer overlying the silicon based substrate and the contact pad, and the passivation layer having an opening therein exposing at least a portion of the contact pad, and a redistribution trace electrically connected to the contact pad near a first end and having a second end of spaced a distance from the contact pad. Forming an encapsulation layer over the semiconductor device including the redistribution trace. Forming an opening in the encapsulation layer down to the redistribution trace. Forming a contact post in the opening in the encapsulation layer, and the contact post having a first end electrically connected to the redistribution trace and a second exposed end. Forming an electrically conductive bump on the semiconductor device and in electrical contact with the contact post.

REFERENCES:
patent: 5219787 (1993-06-01), Carey et al.
patent: 6103552 (2000-08-01), Lin
patent: 6181569 (2001-01-01), Chakravorty
patent: 6566239 (2003-05-01), Makino et al.
patent: 6583040 (2003-06-01), Lin
patent: 2002/0121692 (2002-09-01), Lee et al.

Affiliated with

Also associated with

Rating

Method of wafer level chip scale packaging does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of wafer level chip scale packaging, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of wafer level chip scale packaging will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3450602