Chip carrier semiconductor device assembly

Details Chip carrier semiconductor device assembly Chip carrier semiconductor device assembly

1994-12-16

1997-02-11

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With bumps on ends of lead fingers to connect to semiconductor

257668, 257678, H01L 23495

Patent

active

056024193

ABSTRACT:
A chip carrier semiconductor device comprises a semiconductor chip having a surface on which a plurality of contact pads, a tape carrier overlying the semiconductor chip and a plurality of leads provided on the tape carrier to overly the semiconductor chip, each of the leads having an inside end being provided with at last one bump for bonding a board, the bump being positioned on an inside area of the contact pads.

REFERENCES:
patent: 5229916 (1993-07-01), Frankeny et al.
patent: 5350947 (1994-09-01), Takekawa et al.
By L. Matthew et al., "Future directions in TAB: the TCC/MCM Interconnect", ITAP & Flip Chip Proceedings, Dec. 1994, pp. 228-231.
IBM Microelectronics, Tape Balle Grid Array (TBGA), Doc. #SPMATBSFU-03, 4 pages. Aug. 1993.

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