Method of fabricating a zener diode chip for use as a shunt...

Details Method of fabricating a zener diode chip for use as a shunt... Method of fabricating a zener diode chip for use as a shunt...

2005-05-31

2005-05-31

Zarabian, Amir (Department: 2822)

Semiconductor device manufacturing: process

Making field effect device having pair of active regions...

Having insulated gate

C438S328000, C438S380000, C438S983000

Reexamination Certificate

active

06900093

ABSTRACT:
A process for fabricating Zener diodes that does not require the use of photomasks. An oxide layer is grown on a silicon substrate which is doped with an N-type dopant. The substrate is subsequently implanted with a P-type dopant, forming a PN junction. The substrate is then metallized for connecting the Zener diode to other circuit components. Advantageously, the substrate may be scribed after processing, before processing, or anytime during processing. Back-to-back Zener diodes formed in this manner are used as shunt circuits across individual lamp sockets in series-wired Christmas light strings to maintain current flow to each of the lamps of the light string when one or multiple lamps fail.

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