Method for forming an electronic device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S232000, C438S305000

Reexamination Certificate

active

06884672

ABSTRACT:
Under the present invention, a layer of amorphous silicon is formed over a layer of gate dielectric. Over the layer of amorphous silicon, a gate cap dielectric is formed. The layer of amorphous silicon is then confined by at least one spacer, which is deposited under a low temperature process. Once the at least one spacer is in place, the amorphous silicon is exposed to a temperature sufficiently high to convert the amorphous silicon to polysilicon. By waiting until the amorphous silicon is confined within the at least one spacer before converting it to polysilicon, the variation in gate length is reduced.

REFERENCES:
patent: 5482895 (1996-01-01), Hayashi et al.
patent: 5539229 (1996-07-01), Noble et al.
patent: 5563093 (1996-10-01), Koda et al.
patent: 5576244 (1996-11-01), Hayashi et al.
patent: 5661051 (1997-08-01), Yeh et al.
patent: 5767004 (1998-06-01), Balasubramanian et al.
patent: 5773348 (1998-06-01), Wu
patent: 5882965 (1999-03-01), Schwalke et al.
patent: 6023093 (2000-02-01), Gregor et al.
patent: 6049113 (2000-04-01), Shida
patent: 6057555 (2000-05-01), Reedy et al.
patent: 6069054 (2000-05-01), Choi
patent: 6087231 (2000-07-01), Xiang et al.
patent: 6090648 (2000-07-01), Reedy et al.
patent: 6096614 (2000-08-01), Wu
patent: 6117717 (2000-09-01), Carbone et al.
patent: 6159810 (2000-12-01), Yang
patent: 6162716 (2000-12-01), Yu et al.
patent: 6200835 (2001-03-01), Manning
patent: 6228722 (2001-05-01), Lu
patent: 6294442 (2001-09-01), Kamal
patent: 6297173 (2001-10-01), Tobin et al.
patent: 6303493 (2001-10-01), Lee
patent: 6323094 (2001-11-01), Wu
patent: 6391732 (2002-05-01), Gupta et al.
patent: 6432763 (2002-08-01), Yu
patent: 6437381 (2002-08-01), Gruening et al.
patent: 6482722 (2002-11-01), Kunii et al.
patent: 6521502 (2003-02-01), Yu
patent: 6620671 (2003-09-01), Wang et al.
patent: 6635946 (2003-10-01), Lai et al.
patent: 6646307 (2003-11-01), Yu et al.
patent: 6661044 (2003-12-01), Jang
patent: 6664143 (2003-12-01), Zhang
patent: 6670224 (2003-12-01), Lee et al.
patent: 6709907 (2004-03-01), Yamazaki et al.
patent: 6730572 (2004-05-01), Lee et al.
patent: 6753216 (2004-06-01), Mathew et al.
patent: 6770944 (2004-08-01), Nishinohara et al.
patent: 6780705 (2004-08-01), Yasuda
patent: 6794277 (2004-09-01), Machida et al.
patent: 6803315 (2004-10-01), Dokumaci et al.
patent: 20020086503 (2002-07-01), Schuegraf et al.
patent: 0989604 (2000-03-01), None
patent: 8274185 (1996-10-01), None
patent: 9017998 (1997-01-01), None
patent: 2000114396 (2000-04-01), None

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