Flex-based IC package construction employing a balanced...

Details Flex-based IC package construction employing a balanced... Flex-based IC package construction employing a balanced...

2005-04-05

2005-04-05

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S686000, C257S723000, C257S724000, C257S738000

Reexamination Certificate

active

06876088

ABSTRACT:
The present invention provides for a balanced laminated integrated circuit package. The package includes a two metal layer bumped circuit, a first adhesive layer having a thickness on a first side of the bumped circuit, a first outer conductive layer having a thickness bonded to the first adhesive layer and a second adhesive layer having a thickness substantially equal to the thickness of the first adhesive layer on a second side of the bumped circuit. The invention also includes a second outer conductive layer bonded to the second adhesive layer, the second outer conductive layer having a thickness substantially equal to the thickness of the first outer conductive layer.

REFERENCES:
patent: 4642889 (1987-02-01), Grabbe
patent: 5097393 (1992-03-01), Nelson et al.
patent: 5108553 (1992-04-01), Foster et al.
patent: 5252857 (1993-10-01), Kane et al.
patent: 5266746 (1993-11-01), Nishihara et al.
patent: 5357403 (1994-10-01), Haller et al.
patent: 5474458 (1995-12-01), Vafi et al.
patent: 5476818 (1995-12-01), Yanof et al.
patent: 5578796 (1996-11-01), Bhatt et al.
patent: 5639696 (1997-06-01), Liang et al.
patent: 5642261 (1997-06-01), Bond et al.
patent: 5689091 (1997-11-01), Hamzehdoost et al.
patent: 5736679 (1998-04-01), Kresge et al.
patent: 5758413 (1998-06-01), Chong et al.
patent: 5814393 (1998-09-01), Miyaake et al.
patent: 5814847 (1998-09-01), Shihadeh et al.
patent: 5829124 (1998-11-01), Kresge et al.
patent: 5854507 (1998-12-01), Miremadi et al.
patent: 5861666 (1999-01-01), Bellaar
patent: 5891753 (1999-04-01), Akram
patent: 6034332 (2000-03-01), Moresco et al.
patent: 6050832 (2000-04-01), Lee et al.
patent: 6102710 (2000-08-01), Beilin et al.
patent: 6104082 (2000-08-01), Berlin et al.
patent: 6104084 (2000-08-01), Ishio et al.
patent: 6121676 (2000-09-01), Solberg
patent: 6137164 (2000-10-01), Yew et al.
patent: 6140707 (2000-10-01), Plepys et al.
patent: 6153508 (2000-11-01), Harvey
patent: 6175158 (2001-01-01), Degani et al.
patent: 6175161 (2001-01-01), Goetz et al.
patent: 6194250 (2001-02-01), Melton et al.
patent: 6222265 (2001-04-01), Akram et al.
patent: 6291267 (2001-09-01), Dore et al.
patent: 6297551 (2001-10-01), Dudderar et al.
patent: 6331939 (2001-12-01), Corisis et al.
patent: 6333563 (2001-12-01), Jackson et al.
patent: 6756685 (2004-06-01), Tao
patent: 2001-156121 (2001-06-01), None
Farber, A. S.; “High-Capacitance Power Distribution Network”;IBM Technical Disclosure Bulletin; Mar. 1967; vol. 9, No. 10; p. 1266.
Cavaliere, J. R. et al.; “High-Performance Single-Chip Module”;IBM Technical Disclosure Bulletin; Jun. 1981; vol. 24, No. 1A; pp. 46-48.

Affiliated with

Also associated with

Rating

Flex-based IC package construction employing a balanced... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flex-based IC package construction employing a balanced..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flex-based IC package construction employing a balanced... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3412844