Physical vapor deposition apparatus and process

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

Reexamination Certificate

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Details

C204S298040, C204S298150, C118S7230VE, C118S7230EB, C118S719000, C118S726000, C118S729000, C427S576000, C427S595000, C427S596000, C427S597000, C427S248100, C427S251000, C427S255500

Reexamination Certificate

active

06869508

ABSTRACT:
A PVD process and apparatus (120) for depositing a coating (132) from multiple sources (110, 111) of different materials. The process and apparatus (120) are particulaity intended to deposit a beta-nickel aluminide coating (132) containing one or more elements whose vapor pressures are lower than NiAl. The PVD process and apparatus (120) entail feeding at least two materials (110, 111) into a coating chamber (122) and evaporating the materials (110, 111) at different rates from separate molten pools (114, 115) thereof. Articles (130) to be coated are suspended within the coating chamber (122), and transported with a support apparatus (118) relative to the two molten pools (114, 115) so as to deposit a coating (132) with a controlled composition that is a mixture of the first and second materials (110, 111).

REFERENCES:
patent: 5296274 (1994-03-01), Movchan et al.
patent: 5975852 (1999-11-01), Nagaraj et al.
patent: 6042898 (2000-03-01), Burns et al.
patent: 6153313 (2000-11-01), Rigney et al.
patent: 6174571 (2001-01-01), Corderman et al.
patent: 6255001 (2001-07-01), Darolia
patent: 6291084 (2001-09-01), Darolia et al.
patent: 05156438 (1993-06-01), None
patent: 06322521 (1994-11-01), None

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