Method for fabricating a structure for making contact with...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S426100, C029S593000, C029S829000, C029S840000, C029S842000, C029S843000, C029S846000, C029S874000, C029S876000, C029S882000, C324S754090

Reexamination Certificate

active

06880245

ABSTRACT:
Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.

REFERENCES:
patent: 5086337 (1992-02-01), Noro et al.
patent: 5414371 (1995-05-01), Isaac
patent: 5900738 (1999-05-01), Khandros et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for fabricating a structure for making contact with... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating a structure for making contact with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating a structure for making contact with... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3404644

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.