Chemically amplified negative photoresist composition for...

Details Chemically amplified negative photoresist composition for... Chemically amplified negative photoresist composition for...

2005-01-04

2005-01-04

Schilling, Richard L. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

C430S270100, C430S905000, C430S914000, C430S927000

Reexamination Certificate

active

06838229

ABSTRACT:
A chemically amplified negative photoresist composition is used for the formation of thick films having a thickness of 20 to 150 μm and includes (A) an alkali-soluble resin, (B) a compound which generates an acid upon irradiation with active light or radiant ray, and (C) a compound which serves as a crosslinking agent in the presence of an acid. The alkali-soluble resin (A) includes (a1) a novolak resin having a weight average molecular weight of from 5000 to 10000, and (a2) a polymer containing at least a hydroxystyrene constitutional unit and having a weight average molecular weight of less than or equal to 5000.

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Derwent No. 2002-150652, Dec. 5, 2002; Ahsti of Kr 2001051692, Korea, published Jun. 25, 2001.

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