Polymer, resist composition and patterning process

Details Polymer, resist composition and patterning process Polymer, resist composition and patterning process

2005-01-18

2005-01-18

Ashton, Rosemary (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S326000, C430S910000, C526S282000, C526S270000

Reexamination Certificate

active

06844133

ABSTRACT:
A polymer comprising recurring units of formula (1) wherein R1is H or methyl, R2is H or C1-8alkyl, R3is CO2R4, and R4is C1-15alkyl and recurring units having a carboxylic acid protected with an acid-decomposable protecting group containing an adamantane structure or tetracyclo-[4.4.0.12,5.17,10]dodecane structure and having a Mw of 1,000-500,000 is novel. A resist composition comprising the polymer as a base resin is sensitive to high-energy radiation, has excellent sensitivity, resolution and etching resistance and lends itself to micropatterning with electron beams or deep-UV

REFERENCES:
patent: 6280898 (2001-08-01), Hasegawa et al.
patent: 6462158 (2002-10-01), Miwa et al.
patent: 20010026901 (2001-10-01), Maeda et al.
patent: 20030108809 (2003-06-01), Sato
patent: 20030130039 (2003-07-01), Kobayashi et al.
patent: 9-73173 (1997-03-01), None
patent: 9-90637 (1997-04-01), None
patent: 3042618 (2000-03-01), None
patent: 2000-159758 (2000-06-01), None
patent: 2000-336121 (2000-12-01), None
patent: 2002-169289 (2002-06-01), None
Computer English translation of JP 2002-169289, Jun. 2002.*
JPO abstract JP 2002-169289, Jun. 2002.

Affiliated with

Also associated with

Rating

Polymer, resist composition and patterning process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polymer, resist composition and patterning process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polymer, resist composition and patterning process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3396291