Flash-preventing window ball grid array semiconductor...

Details Flash-preventing window ball grid array semiconductor... Flash-preventing window ball grid array semiconductor...

2005-03-22

2005-03-22

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S774000, C257S782000, C257S784000

Reexamination Certificate

active

06870274

ABSTRACT:
A flash-preventing window ball grid array semiconductor package, a method for fabricating the same, and a chip carrier used in the semiconductor package are provided. The chip carrier has a through hole and has a surface formed with a plurality of wire-bonding portions, ball-bonding portions and intended-exposing regions. A chip is mounted over the through hole and electrically connected to the wire-bonding portions by a plurality of bonding wires penetrating through the through hole. An encapsulation body encapsulates the chip and bonding wires. The intended-exposing regions serve as a narrow runner which is filled with an encapsulating material forming the encapsulation body, making the encapsulating material not flash over the ball-bonding portions. This allows a plurality of solder balls to be well bonded to the ball-bonding portions, thereby assuring the quality of electrical connection and the surface planarity of the semiconductor package.

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patent: 20020100989 (2002-08-01), Jiang et al.
patent: 20040061239 (2004-04-01), Bai

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