Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-04-05
2005-04-05
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S613000, C438S614000
Reexamination Certificate
active
06875683
ABSTRACT:
A method of forming a bump on an active surface of a wafer is disclosed. The method of the invention forms an under ball metallurgy (UBM) onto the active surface of the wafer. Then, the UBM is partially removed until a portion of the active surface of the wafer is exposed. At least one conductive stud is bonded onto the non-removed UBM by wire bonding.
REFERENCES:
patent: 5903058 (1999-05-01), Akram
patent: 6181569 (2001-01-01), Chakravorty
patent: 6475897 (2002-11-01), Hosaka
patent: 08-213399 (1996-08-01), None
Chen Jau-Shoung
Fang Jen-Kuang
Huang Min-Lung
Lee Chun-Chi
Lee Yung-Chi
Advanced Semiconductor Engineering Inc.
Jianq Chyun IP Office
Jr. Carl Whitehead
Pham Thanhha
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