Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-05-31
2005-05-31
Smith, Matthew (Department: 2825)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S643000, C438S609000, C438S678000, C438S030000, C438S608000, C349S139000, C349S152000, C349S143000, C349S043000, C349S042000, C257S072000, C257S059000
Reexamination Certificate
active
06900120
ABSTRACT:
Disclosed are a liquid crystal display device and a method for manufacturing the same, in which wirings connected between pads and an integrated circuit is protected from being corroded. A pixel array is formed on a display region of a substrate. A plurality of pads are formed on a non-display region of the substrate. An integrated circuit is formed on the non-display region of the substrate and connected to the pads to generate a signal for operating the pixel array. Conductive barrier layers separated from each of the pads are formed on peripheral portions of the pads connected to the integrated circuit. The conductive barrier layers have electric potential equivalent to that of each of the pads in accordance with internal connections of the integrated circuit. When bumps of the integrated circuit and the pads are attached to each other, the conductive barrier layers prevent the pads and the wirings connected to the pads from being corroded.
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Jung Young-Bae
Lee Eung-Sang
Lee Won-Kyu
Ma Won-Seok
Samsung Electronics Co,. Ltd.
Smith Matthew
Yevsikov Victor V
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