Method of manufacturing semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S157000, C438S176000

Reexamination Certificate

active

06881631

ABSTRACT:
A method of manufacturing a semiconductor device comprises forming a first conductive material film on a semiconductor substrate with a gate insulating film interposed therebetween, selectively forming a second conductive material film on the first conductive material film, the second conductive material film being capable of reducing the first conductive material film, causing that portion of the first conductive material film which is selectively covered with the second conductive material film to be subjected to a reducing reaction with the second conductive material film so as to change the composition of the resultant film and to form a third conductive material film differing in the work function from the first conductive material film, and forming a first gate electrode having the first conductive material film and a second gate electrode having at least the third conductive material film and differing from the first gate electrode in the work function.

REFERENCES:
patent: 4814854 (1989-03-01), Tigelaar et al.
patent: 5512771 (1996-04-01), Hiroki et al.
patent: 6027961 (2000-02-01), Maiti et al.
patent: 6074915 (2000-06-01), Chen et al.
patent: 6111619 (2000-08-01), He et al.
patent: 6140688 (2000-10-01), Gardner et al.
patent: 6291282 (2001-09-01), Wilk et al.
patent: 6468851 (2002-10-01), Ang et al.
patent: 6475908 (2002-11-01), Lin et al.
patent: 6506676 (2003-01-01), Park et al.
patent: 6514827 (2003-02-01), Kim et al.
patent: 6524904 (2003-02-01), Segawa et al.
patent: 6528371 (2003-03-01), Kim
patent: 6528401 (2003-03-01), Bae et al.
patent: 6660577 (2003-12-01), Chen et al.
patent: 6677652 (2004-01-01), Lin et al.
patent: 6689676 (2004-02-01), Pham et al.
patent: 6693333 (2004-02-01), Yu
patent: 6696328 (2004-02-01), Rhee et al.
patent: 6706581 (2004-03-01), Hou et al.
patent: 6727130 (2004-04-01), Kim et al.
patent: 6730572 (2004-05-01), Lee et al.
patent: 6750519 (2004-06-01), Lin et al.
patent: 6750532 (2004-06-01), Rhee et al.
patent: 6784060 (2004-08-01), Ryoo
patent: 6790719 (2004-09-01), Adetutu et al.
patent: 6794232 (2004-09-01), Zheng et al.
patent: 6794234 (2004-09-01), Polishchuk et al.
patent: 6808985 (2004-10-01), Lee et al.
patent: 6815285 (2004-11-01), Choi et al.
patent: 08172139 (1996-07-01), None
patent: 08186259 (1996-07-01), None
patent: 2002-198441 (2002-07-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3381710

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.