Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-04-26
2005-04-26
Thomas, Tom (Department: 2815)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S457000, C438S685000, C438S782000, C438S785000, C438S917000
Reexamination Certificate
active
06884718
ABSTRACT:
An apparatus and process for depositing a barrier film on a substrate is disclosed. In particular, deposition of the barrier film is carried out on the substrate having an applied pressure. This applied pressure flexes the substrate to reduce in-plane stresses, wherein removal of the applied pressure after deposition of the barrier film modifies the in-film stress for the thin-film. With the above-described arrangement, it is possible to minimize the deterioration of electric characteristics of a semiconductor device and the occurrence of defects, such as film delamination, substrate cracks, and the like.
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Thomas Tom
Warren Matthew E.
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