Method for making a semiconductor device having a high-k...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S554000, C438S003000

Reexamination Certificate

active

06617209

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to methods for making semiconductor devices, in particular, semiconductor devices that include high-k gate dielectric layers.
BACKGROUND OF THE INVENTION
MOS field-effect transistors with very thin gate dielectrics made from silicon dioxide may experience unacceptable gate leakage currents. Forming the gate dielectric from certain high-k dielectric materials, in place of silicon dioxide, can reduce gate leakage. Such a dielectric may not, however, be compatible with polysilicon—the preferred material for making the device's gate electrode. Placing a thin layer of titanium nitride, which is compatible with many high-k gate dielectrics, between a high-k gate dielectric and a polysilicon-based gate electrode may enable such a dielectric to be used with such a gate electrode. Unfortunately, the presence of such a layer may increase the transistor's threshold voltage, which is undesirable.
Accordingly, there is a need for an improved process for making a semiconductor device that includes a high-k gate dielectric. There is a need for such a process in which a polysilicon-based gate electrode is formed on such a gate dielectric to create a functional device—without causing undesirable work function shifts. The method of the present invention provides such a process.


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Doug Barlage et al., “High-Frequency Response of 100nm Integrated CMOS Transistors with High-K Gate Dielectrics”, 2001 IEEE, 4 pages.
Robert Chau et al., A 50nm Depleted-Substrate CMOS Transistor (DST), 2001 IEEE, 4 pages.

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