Method of making three dimensional, 2R memory having a 4F2...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE21665, C438S295000

Reexamination Certificate

active

07381616

ABSTRACT:
A method of fabricating a multi-level 3D memory array includes: preparing a wafer and peripheral circuits thereon; layers of metal, memory resistor material, and metal are deposited, patterned and etched. The steps of the method of the invention are repeated for N levels of a memory array.

REFERENCES:
patent: 7009278 (2006-03-01), Hsu
patent: 7236389 (2007-06-01), Hsu
patent: 7291878 (2007-11-01), Stipe
patent: 2007/0132049 (2007-06-01), Stipe

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of making three dimensional, 2R memory having a 4F2... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making three dimensional, 2R memory having a 4F2..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making three dimensional, 2R memory having a 4F2... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2813677

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.