Microelectronic device interconnects

Details Microelectronic device interconnects Microelectronic device interconnects

2008-01-01

2008-01-01

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000, C257S739000, C257S778000, C257SE23021, C257SE23023

Reexamination Certificate

active

07314817

ABSTRACT:
A microelectronic assembly including a plurality of conductive columns extending from a bond pad of a microelectronic device and a conductive adhesive on a land pad of a carrier substrate electrically attached to the conductive columns.

REFERENCES:
patent: 5686762 (1997-11-01), Langley
patent: 5739587 (1998-04-01), Sato
patent: 5923088 (1999-07-01), Shiue et al.
patent: 6163074 (2000-12-01), Lee et al.
patent: 6313540 (2001-11-01), Kida et al.
patent: 6384343 (2002-05-01), Furusawa
patent: 6593643 (2003-07-01), Seki et al.
Wolf et al., “Silicon Processing for the VLSI Era”, 2000, pp. 851-852, vol. 1, Lattice-Press, USA.

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