Method for fabricating transistor of semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S259000, C438S270000, C438S274000, C438S297000, C438S298000, C438S362000, C438S370000, C438S423000, C438S700000, C438S425000, C257SE21429, C257SE21166, C257SE21548, C257SE21555, C257SE21553

Reexamination Certificate

active

07314792

ABSTRACT:
A method for fabricating a transistor of a semiconductor device is provided. The method includes: forming device isolation layers in a substrate including a bottom structure, thereby defining an active region; etching the active region to a predetermined depth to form a plurality of recess structures each of which has a flat bottom portion with a critical dimension (CD) larger than that of a top portion; and sequentially forming a gate oxide layer and a metal layer on the recess structures; and patterning the gate oxide layer and the metal layer to form a plurality of gate structures.

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Notice of Preliminary Rejection from the Korean Intellectual Property Office, dated Nov. 20, 2006, in counterpart Korean Patent Application No. 2005-36184.
First Office Action from the State Intellectual Property Office of the People's Republic of China dated Aug. 17, 2007 in counterpart Chinese patent application No. 200510135164.6.

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