Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-07-01
2008-07-01
Le, Thao X. (Department: 2892)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257S779000, C257SE23112
Reexamination Certificate
active
07393771
ABSTRACT:
An electronic part mounting method, a semiconductor module, and a semiconductor device, which can reduce a mounting area and a device thickness. In an electronic part mounting method for bonding an electrode formed on a substrate and an electrode formed on an electronic part to each other, the method comprises the step of bonding both the electrodes through a metal layer made up of aggregated particles of at least one kind of metal. Then, the metal particles have an average particle size of 1 to 50 nm. Preferably, the metal particles form a metal layer having a thickness of 5 to 100 μm.
REFERENCES:
patent: 5162087 (1992-11-01), Fukuzawa et al.
patent: 5780931 (1998-07-01), Shimoda et al.
patent: 6297564 (2001-10-01), Chung
patent: 6519842 (2003-02-01), Fukunaga et al.
patent: 2003/0096089 (2003-05-01), Huang et al.
patent: 2004/0043334 (2004-03-01), Kobayashi et al.
patent: 2004/0245648 (2004-12-01), Nagasawa et al.
patent: 2005/0042838 (2005-02-01), Garyainov et al.
Hozoji Hiroshi
Morita Toshiaki
Sasaki Hiroshi
Arora Ajay K
Crowell & Moring LLP
Hitachi , Ltd.
Le Thao X.
LandOfFree
Method for mounting an electronic part on a substrate using... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for mounting an electronic part on a substrate using..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for mounting an electronic part on a substrate using... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2794432