Semiconductor package having passive component and...

Details Semiconductor package having passive component and... Semiconductor package having passive component and...

2011-03-08

2011-03-08

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S723000, C257S532000

Reexamination Certificate

active

07902664

ABSTRACT:
Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and a cover covering the mounting substrate, the semiconductor chip and the at least one passive component.

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