Methods of titanium deposition

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S656000, C438S664000, C438S683000, C438S685000, C438S913000

Reexamination Certificate

active

07947597

ABSTRACT:
Some embodiments include methods of titanium deposition in which a silicon-containing surface and an electrically insulative surface are both exposed to titanium-containing material, and in which such exposure forms titanium silicide from the silicon-containing surface while not depositing titanium onto the electrically insulative surface. The embodiments may include atomic layer deposition processes, and may include a hydrogen pre-treatment of the silicon-containing surfaces to activate the surfaces for reaction with the titanium-containing material. Some embodiments include methods of titanium deposition in which a semiconductor material surface and an electrically insulative surface are both exposed to titanium-containing material, and in which a titanium-containing film is uniformly deposited across both surfaces.

REFERENCES:
patent: 5924009 (1999-07-01), Park
patent: 5977636 (1999-11-01), Sharan
patent: 6071562 (2000-06-01), Hornback et al.
patent: 6271136 (2001-08-01), Shue et al.
patent: 6977225 (2005-12-01), Iyer et al.
patent: 2002/0168468 (2002-11-01), Chou et al.
patent: 2005/0145897 (2005-07-01), Matsuo et al.
patent: 2006/0113615 (2006-06-01), Lee et al.
patent: 2006/0141152 (2006-06-01), Oh
patent: 2006/0261479 (2006-11-01), Marsh
patent: 2006/0292871 (2006-12-01), Goswami et al.
patent: 2007/0020923 (2007-01-01), Kraus et al.
patent: 2008/0001993 (2008-01-01), Cornell et al.
patent: 2008/0193649 (2008-08-01), Jacquet et al.
patent: 2008/0254376 (2008-10-01), Lin et al.
patent: 2009/0004098 (2009-01-01), Schmidt et al.
patent: 2009/0184281 (2009-07-01), Yadav et al.

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