Method for manufacturing crystalline semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C257S070000, C257SE21413

Reexamination Certificate

active

07935584

ABSTRACT:
There is provided a method for manufacturing a crystalline semiconductor film. An insulating film is formed over a substrate; an amorphous semiconductor film is formed over the insulating film; a cap film is formed over the amorphous semiconductor film; the amorphous semiconductor film is scanned and irradiated with a continuous wave laser beam or a laser beam with a repetition rate of greater than or equal to 10 MHz, through the cap film; and the amorphous semiconductor film is melted and crystallized At this time, an energy distribution in a length direction and a width direction in a laser beam spot is a Gaussian distribution, and the amorphous semiconductor film is scanned with the laser beam so as to be irradiated with the laser beam for a period of greater than or equal to 5 microseconds and less than or equal to 100 microseconds per region.

REFERENCES:
patent: 5313076 (1994-05-01), Yamazaki et al.
patent: 5643826 (1997-07-01), Ohtani et al.
patent: 5670793 (1997-09-01), Miura et al.
patent: 5753542 (1998-05-01), Yamazaki et al.
patent: 5899547 (1999-05-01), Yamazaki et al.
patent: 5962869 (1999-10-01), Yamazaki et al.
patent: 6172380 (2001-01-01), Noguchi et al.
patent: 6322625 (2001-11-01), Im
patent: 6358766 (2002-03-01), Kasahara
patent: 6423586 (2002-07-01), Yamazaki et al.
patent: 6489222 (2002-12-01), Yoshimoto
patent: 6535535 (2003-03-01), Yamazaki et al.
patent: 6545320 (2003-04-01), Ohtani et al.
patent: 6548370 (2003-04-01), Kasahara et al.
patent: 6787807 (2004-09-01), Yamazaki et al.
patent: 6797550 (2004-09-01), Kokubo et al.
patent: 6808969 (2004-10-01), Yamazaki et al.
patent: 6881615 (2005-04-01), Yamazaki et al.
patent: 6908797 (2005-06-01), Takano
patent: 7022183 (2006-04-01), Takeda et al.
patent: 7078321 (2006-07-01), Yoshimoto
patent: 7112517 (2006-09-01), Tanaka et al.
patent: 7113527 (2006-09-01), Tanaka
patent: 7125761 (2006-10-01), Tanaka
patent: 7217605 (2007-05-01), Kawasaki et al.
patent: 7220627 (2007-05-01), Yamazaki et al.
patent: 7319055 (2008-01-01), Kokubo et al.
patent: 7384810 (2008-06-01), Tai et al.
patent: 7397831 (2008-07-01), Hongo et al.
patent: 2002/0052069 (2002-05-01), Jiroku et al.
patent: 2003/0085720 (2003-05-01), Yamazaki et al.
patent: 2003/0100169 (2003-05-01), Tanaka et al.
patent: 2004/0038438 (2004-02-01), Shih et al.
patent: 2004/0069751 (2004-04-01), Yamazaki et al.
patent: 2004/0119955 (2004-06-01), Tanaka
patent: 2004/0136416 (2004-07-01), Tanaka
patent: 2004/0169023 (2004-09-01), Tanaka
patent: 2004/0195222 (2004-10-01), Tanaka et al.
patent: 2004/0209410 (2004-10-01), Tanaka
patent: 2004/0253838 (2004-12-01), Yamazaki et al.
patent: 2005/0003591 (2005-01-01), Takaoka et al.
patent: 2005/0036190 (2005-02-01), Tanaka
patent: 2005/0037552 (2005-02-01), Yamazaki et al.
patent: 2005/0037553 (2005-02-01), Tanaka
patent: 2005/0115930 (2005-06-01), Tanaka et al.
patent: 2005/0139786 (2005-06-01), Tanaka et al.
patent: 2005/0202602 (2005-09-01), Asami et al.
patent: 2006/0003478 (2006-01-01), Hongo et al.
patent: 2006/0118036 (2006-06-01), Takeda et al.
patent: 2006/0246693 (2006-11-01), Tanaka et al.
patent: 2007/0070319 (2007-03-01), Nakamura et al.
patent: 2007/0087488 (2007-04-01), Moriwaka
patent: 2007/0148936 (2007-06-01), Ohnuma
patent: 2007/0222038 (2007-09-01), Moriwaka
patent: 2007/0264836 (2007-11-01), Chen et al.
patent: 2008/0210945 (2008-09-01), Miyairi
patent: 2008/0318398 (2008-12-01), Moriwaka et al.
patent: 0 651 431 (1995-05-01), None
patent: 05-299339 (1993-11-01), None
patent: 07-135174 (1995-05-01), None
patent: 11-145056 (1999-05-01), None
patent: 2004-179195 (2004-06-01), None
patent: 2004-327677 (2004-11-01), None
patent: 2005-191546 (2005-07-01), None
patent: 2006-310445 (2006-11-01), None
Ohashi, et al., TFTp5-4:, “Crystalline Orientation of Large-Grain Poly-Si Thin Films Observed by Raman Spectroscopy”, AM-LCD '04:, International Workshop Active-Matrix Liquid-Crystal Displays, Issued Aug. 25, 2004, pp. 269-272.
Sotani et al., “Crystallization of Amorphous Si Films Using Indirect Heating by High Power CW-YAG Laser-Zone Melting for Film (III)”, Extended Abstracts from the 50thMeeting of the Japan Society of Applied Physics and Related Societies, Issued Mar. 27, 2003, No. 2, pp. 925. (Full Translation).

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