Method for manufacturing capacitor of semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S381000, C438S513000, C438S637000, C438S706000, C438S745000, C257SE21170, C257SE21229, C257SE21231, C257SE21259, C257SE21267, C257SE21319, C257SE21646, C257SE21648

Reexamination Certificate

active

07875515

ABSTRACT:
A method for manufacturing a capacitor of a semiconductor device includes: forming an interlayer insulating film including a contact plug over a semiconductor substrate; forming a first stack film including a capacitor oxide film and a nitride film over the interlayer insulating film; etching the first stack film to form a first stack pattern and a contact hole that exposes the contact plug; forming a lower electrode in the contact hole; forming a capping oxide film continuously over the first stack pattern to form a bridge connecting the neighboring first stack patterns; forming an etching barrier film including cavities over the capping oxide film; performing a blanket etching process onto the etching barrier film including cavities until the capacitor oxide film is exposed to form a nitride film pattern; and removing the exposed capacitor oxide film.

REFERENCES:
patent: 5401681 (1995-03-01), Dennison
patent: 5795806 (1998-08-01), Tseng
patent: 5960280 (1999-09-01), Jenq et al.
patent: 6030867 (2000-02-01), Chien et al.
patent: 6159788 (2000-12-01), Jenq et al.
patent: 10-2000-0034608 (2000-06-01), None
patent: 10-2004-0059803 (2004-07-01), None
patent: 10-2005-0019301 (2005-03-01), None
patent: 10-2007-0051216 (2007-05-01), None

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