Device for liquid treatment of wafer-shaped articles

Details Device for liquid treatment of wafer-shaped articles Device for liquid treatment of wafer-shaped articles

2011-08-02

2011-08-02

MacArthur, Sylvia R. (Department: 1716)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With workpiece support

C156S345210

Reexamination Certificate

active

07988818

ABSTRACT:
A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, in which a mask is kept at a defined short distance to the wafer-shaped article such that liquid can be retained between the mask and the defined area of the wafer-shaped article by capillary force.

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