Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate
2011-04-19
2011-04-19
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
C257S671000, C257S692000, C257S735000, C257SE23070, C257SE23055, C257SE23056, C257SE23034, C257SE21511
Reexamination Certificate
active
07928543
ABSTRACT:
A tape wiring substrate may have dispersion wiring patterns. The dispersion wiring patterns may be provided between input/output wiring pattern groups to compensate for the intervals therebetween. Connecting wiring patterns may be configured to connect the dispersion wiring patterns to a first end of the adjacent input/output wiring pattern.
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Clark Jasmine J
Samsung Electronics Co,. Ltd.
Volentine & Whitt PLLC
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