Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
2011-08-09
2011-08-09
Flanigan, Allen J (Department: 3744)
Heat exchange
With retainer for removable article
Electrical component
C165S908000, C361S699000
Reexamination Certificate
active
07992627
ABSTRACT:
Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.
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Bezama Raschid J.
Natarajan Govindarajan
Sikka Kamal K.
Toy Hilton T.
DeLio & Peterson LLC
Flanigan Allen J
International Business Machines - Corporation
Nowak Kelly M.
Petrokaitis Joseph
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