Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate
2011-06-28
2011-06-28
Parker, Ken A (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
C257S292000, C257S440000, C257SE31121
Reexamination Certificate
active
07968923
ABSTRACT:
An image sensor pixel includes a photo-sensor region, a microlens, a first color filter layer, and a second color filter layer. The photo-sensor region is disposed within a semiconductor die. The microlens is disposed on the semiconductor die in optical alignment with the photo-sensor region. The first color filter layer is disposed between the photo-sensor region and the microlens. The second color filter layer is disposed on an opposite side of the microlens as the first color filter layer.
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Agranov, G., Berezin, V., and Tsai, R., “Crosstalk and Microlens Study in a Color CMOS Image Sensor,” IEEE Transactions on Electron Devices, vol. 50, No. 1, Jan. 2003, pp. 4-11.
Hsu, T. et al. “A High-Efficiency CMOS Image Sensor With Air Gap in situ MicroLens (AGML) Fabricated by 0.18-μm CMOS Technology,” IEEE Electron Device Letters, vol. 26, No. 9, Sep. 2005, pp. 634-636.
Nagaraja Satyadev
Venezia Vincent
Blakely Sokoloff Taylor and Zafman LLP
Diaz José R
OmniVision Technologies Inc.
Parker Ken A
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