Process for forming a plated film, and process for...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface

Reexamination Certificate

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C430S313000, C430S317000, C430S270100, C427S128000, C427S129000

Reexamination Certificate

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07947434

ABSTRACT:
The process of forming a plated film according to the invention is designed such that the surface asperities of the inorganic film formed by the tracing of a standing wave occurring at the inner wall surface of the first opening in the resist at the resist pattern-formation step are reduced or eliminated. It is thus possible to form, efficiently yet in a short period of time, a high aspect-ratio plated film portion having an aspect ratio of greater than 1. In addition, the formed plated film quality is extremely improved for the absence of pores (cavities).

REFERENCES:
patent: 5721078 (1998-02-01), Kamijima
patent: 5725997 (1998-03-01), Kamijima
patent: 5747198 (1998-05-01), Kamijima
patent: 6635408 (2003-10-01), Kamijima
patent: 7417825 (2008-08-01), Sasaki et al.
patent: 2001-167407 (2001-06-01), None
patent: 2006-18985 (2006-01-01), None
patent: 2006-201227 (2006-08-01), None
U.S. Appl. No. 11/677,245, filed Feb. 21, 2007, Kamijima.
U.S. Appl. No. 11/674,374, filed Feb. 13, 2007, Kamijima.

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