High density test probe with rigid surface structure

Details High density test probe with rigid surface structure High density test probe with rigid surface structure

1998-05-13

2000-05-16

Bradley, Paula

Electrical connectors

Including elastomeric or nonmetallic conductive portion

Adapted to be sandwiched between preformed panel circuit...

439 66, H01R 404

Patent

active

060628790

ABSTRACT:
The present invention is a structure for probing an electronic device. The structure has a layer of elastomeric material having a first side and a second side; a plurality of electrical conductors extending from the first side to the second side; each of the electrical conductors has a first end and a second end, the first end extends to the first side, the second end extends to said second side; a layer of dielectric material disposed on the first side; the first end of the plurality of electrical conductors extends into openings in the layer of dielectric material. More particularly, in the present invention, the second side is disposed in contact with a first surface of a substrate and the second ends of the electrical conductors are electrically connected to first electrical contact locations on the first surface.

REFERENCES:
patent: 4548451 (1985-10-01), Benarr et al.
patent: 5385477 (1995-01-01), Vaynkof et al.
patent: 5531022 (1996-07-01), Beaman et al.
patent: 5733640 (1998-03-01), Horiuchi et al.
patent: 5810607 (1998-09-01), Shih et al.

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