Method of forming shared contact structure

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438597, 438637, 148DIG20, H01L 218244

Patent

active

058245790

ABSTRACT:
A shared contact structure (30) is formed to electrically connect three coupling layers (59,60,46) to each other and to an active region (33) in a semiconductor substrate (31). A first coupling layer (59) and a second coupling layer (60) are formed such that they are physically isolated from each other. The second coupling layer (60) is formed such that it is in physical contact with the active region (33). A contact opening (45) is formed, which exposes a portion of coupling layers (59, 60). The third coupling layer (46) is then formed so that it is in electrical contact with the second coupling layer (60) and the first coupling layer (59).

REFERENCES:
patent: 4322736 (1982-03-01), Sasaki et al.
patent: 4908688 (1990-03-01), Lund et al.
patent: 4966864 (1990-10-01), Pfiester
patent: 4977105 (1990-12-01), Okamoto et al.
patent: 5296729 (1994-03-01), Yamanaka et al.
patent: 5373170 (1994-12-01), Pfiester et al.
patent: 5459688 (1995-10-01), Pfiester et al.
patent: 5514880 (1996-05-01), Nishimura et al.
patent: 5589415 (1996-12-01), Blanchard
Faggin, et al.; "A Faster Generation of MOS Devices With Low Thresholds Is Riding The Crest Of The New Wave, Silicon-Gate IC's;" Electronics; pp. 88-94 (1969).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming shared contact structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming shared contact structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming shared contact structure will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-243787

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.