High current hermetic package including an internal foil and hav

Details High current hermetic package including an internal foil and hav High current hermetic package including an internal foil and hav

1989-07-03

1991-05-21

Hille, Rolf

357 74, H01L 2348

Patent

active

050180029

ABSTRACT:
A hermetic semiconductor chip package includes a conductive foil bonded to a contact pad of the chip and connected to an external lead of the package through an aperture in the insulating material of the package lid.

REFERENCES:
patent: 3740619 (1973-06-01), Rosvold
patent: 4386362 (1983-05-01), Kessler, Jr. et al.
patent: 4453176 (1984-06-01), Chance et al.
patent: 4503597 (1985-03-01), Kushima et al.
patent: 4667219 (1987-05-01), Lee et al.
patent: 4667220 (1987-05-01), Lee et al.
patent: 4750666 (1988-06-01), Neugebauer et al.
patent: 4807021 (1989-02-01), Okumura
patent: 4905075 (1990-02-01), Temple et al.
patent: 4918514 (1990-04-01), Matsuda et al.
Technical Notes, A Publication of RCA, TN No.: 851, Oct. 16, 1969, "Improved Contact Means for Multi-Emitter Power Transistors" by Richard Denning.
IBM Technical Disclosure Bulletin, vol. 22, No. 2, Jul. 1979, "Via Joint with Reduced Thermal Gradients" by M. D. Reeder, p. 563.

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