Method for attaching a semiconductor die to a leadframe using a

Details Method for attaching a semiconductor die to a leadframe using a Method for attaching a semiconductor die to a leadframe using a

1990-10-24

1993-01-05

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

361421, 257666, H01L 2158, H01L 2160

Patent

active

051770326

ABSTRACT:
The invention described is directed to a packaged semiconductor chip. As detailed, the invention reduces the number of steps required to attach a die to a leadframe. The invention uses a carrier material layered on one or two sides with thermoplastic which can be softened to a desired state by the application of heat. By heating the thermoplastic and contacting the die and leadframe, the thermoplastic will bond the die and leadframe to the carrier material, thereby securing the die to the leadframe.

REFERENCES:
patent: 3691289 (1972-09-01), Rohloff
patent: 4012835 (1977-03-01), Wallick
patent: 4821944 (1989-04-01), Tsumura
patent: 4882298 (1989-11-01), Moellier et al.
patent: 4886200 (1989-12-01), Tsumura
patent: 4924291 (1990-05-01), Lesk et al.
patent: 4934820 (1990-06-01), Takahashi et al.
patent: 4937656 (1990-06-01), Kohara
patent: 4949160 (1990-08-01), Ohno
patent: 4999742 (1991-03-01), Stampfli
patent: 5062565 (1991-11-01), Wood et al.

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