Preparing highly thermoresistant relief structures

Details Preparing highly thermoresistant relief structures Preparing highly thermoresistant relief structures

Filed on

1990-03-29

Date issued

1992-04-14

Examiner

Hamilton, Cynthia

Patent Class

Radiation imagery chemistry: process, composition, or product th

SubClass

Imaging affecting physical property of radiation sensitive...

SubSubClass

Forming nonplanar surface

Other Related Categories

430325, 430945, 430330, 430270, G03F 7038, G03F 7039, G03F 730, G03F 740

Type

Patent

Status

active

Patent number

051047730

Description

ABSTRACT:
Highly thermoresistant relief structures can be produced simply and cost-effectively from polybenzoxazole precursors which do not have any polymerizable groups, respectively without any photoactive components being present, when soluble hydroxypolyamides are applied in the form of a layer or film on a substrate and are irradiated through a mask by means of an UV-excimer laser with a power density >10.sup.5 W/cm.sup.2 per pulse, and are developed with an aqueous-alkaline developing agent and subsequently tempered.

REFERENCES:
patent: 4332883 (1982-06-01), Ahne et al.
patent: 4339521 (1982-07-01), Ahne et al.
patent: 4366230 (1982-12-01), Ahne et al.
patent: 4371685 (1983-02-01), Ahne et al.
patent: 4395482 (1983-07-01), Ahne et al.
patent: 4622285 (1986-11-01), Ahne et al.
patent: 4849051 (1989-07-01), Ahne et al.
patent: 4927736 (1990-05-01), Mueller et al.
Richard W. Decker, "Laser Exposes PCB's: Computer Controlled Scanning Replaces Photomasks", Printed Circuit Manufacturing, Dec. 1979 pp. 20-24.
"Imidization of Polyamide Acid by Laser Radiation", Sov. J. Quant. Electron, vol. 4, No. 10, Apr. 1975 pp. 1287-1288.
"Thermal Action of Laser Radiation of Imidization", Sov. J. Quantum Electron, vol. 12, No. 10, Oct. 1982 pp. 1330-1333.

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