Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1997-08-26
1999-07-13
Niebling, John F.
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438637, 438647, 438649, 438655, 438657, 438672, 438675, 438682, 438664, 438629, H01L 214763
Patent
active
059240040
ABSTRACT:
A method for forming metal plugs using fewer masks and photolithographic processes than a conventional one and therefore able to simplify the overall manufacturing processes and reduce cost. The steps are:
Niebling John F.
United Microelectronics Corp.
Zarneke David A
LandOfFree
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