Method of adhering a wafer to a wafer tape

Details Method of adhering a wafer to a wafer tape Method of adhering a wafer to a wafer tape

1998-06-02

2000-10-10

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Work-secured and/or work-guided

156285, 156556, 156558, 156580, B32B 3100, B31F 500

Patent

active

061298115

ABSTRACT:
A method and apparatus (10) for securing a fragile wafer (16) to a wafer tape (26) secured taut across a wafer frame (24). A gentle point force (72) is provided by a roller wheel (36) mounted on a rotatable arm (30) to securely adhere the wafer tape (26) to the backside of the wafer (16). Preferably, a spiral pattern (70) is formed by the rotating roller (36) to secure the wafer tape (26) to the wafer (16) to avoid forming air bubbles or creases between the wafer tape and wafer. The method and apparatus is especially suitable for securely adhering fragile wafers to wafer tape that are to be subsequently broken along kerfs.

REFERENCES:
patent: 4787951 (1988-11-01), Okamoto
patent: 4925515 (1990-05-01), Yoshimura et al.
patent: 5286329 (1994-02-01), Iijima et al.
patent: 5961768 (1999-10-01), Tsujimoto

Affiliated with

Also associated with

Rating

Method of adhering a wafer to a wafer tape does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of adhering a wafer to a wafer tape, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of adhering a wafer to a wafer tape will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2253718