4. Adhesive bonding and miscellaneous chemical manufacture
  5. Surface bonding means and/or assembly means therefor
  6. Work-secured and/or work-guided

R. Scott Croff

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Method and apparatus for breaking and separating a wafer...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Method of adhering a wafer to a wafer tape

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Work-secured and/or work-guided
Patent

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Method of adhering a wafer to wafer tape

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Method of breaking and separating a wafer into die using a...

Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1921743

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