Fishing – trapping – and vermin destroying
Patent
1993-05-13
1997-11-25
Breneman, R. Bruce
Fishing, trapping, and vermin destroying
1566561, 1566571, 1566621, 1566431, H01L 2170
Patent
active
056912463
ABSTRACT:
A method of etching an oxide/poly/oxide sandwich structure in which both oxide layers are anisotropically etched, and the poly layer is also isotropically etched to recess the poly from the edge of the contact walls. The oxide etch can be done using oxide to nitride etch stop technology. The process is an in situ etch, that is, a single parallel plate plasma reactor is employed.
REFERENCES:
patent: 4939105 (1990-07-01), Langley
patent: 5013398 (1991-05-01), Long
patent: 5094712 (1992-03-01), Becker
patent: 5096536 (1992-03-01), Cathey
patent: 5110411 (1992-05-01), Long
patent: 5201993 (1993-04-01), Langley
patent: 5330928 (1994-07-01), Tseng
David S. Becker and Guy Blalock, "A Method of Obtaining High Oxide to Nitride Selectivity in an MERIE Reactor", Electrochemical Society, Inc. Conference, May 1993, pp. 367-368.
K.H. Kusters and W. Sesselmann, "A Stacked Capacitor Cell with a Fully Self-Aligned Contact Process for High-Density Dynamic Random Access Memories", J. Electrochem, Soc., vol. 139, No. 8, Aug. 1992, pp. 2318-2320.
H. Itoh, Y. Miyagawa, M. Takahashi, T. Mitsuhashi. Y. Kimura, A. Endoh, Y. Nagatomo, M. Yoshimaru, F. Ichikawa, M. Ino, "1991 Symposium On VLSI Technology--Digest Of Technical Papers", IEEE Cat. No. 91 Ch 3017-1, pp. 9-10.
Becker David S.
Blalock Guy T.
Breneman R. Bruce
Goudreau George
Micro)n Technology, Inc.
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