Multilayer circuit board having microporous layers and process f

Details Multilayer circuit board having microporous layers and process f Multilayer circuit board having microporous layers and process f

1992-07-17

1994-04-12

Kight, III, John

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

430272, 430278, 430271, 430276, 430311, 430279, 430260, 430261, 430273, 430503, G03C 500

Patent

active

053024940

ABSTRACT:
A microporous, photoprocessable, moderately hydrophilic material on which metal can be deposited directly using electroless plating techniques, and its use in preparing printed wiring boards and circuit components.

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Mathotra et al., Hewlett-Packard Journal (Aug./83).

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