Method of making a plug transistor

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438218, 438229, 438275, 438279, 438154, 257274, 257369, 257371, H01L 218238

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active

059703318

ABSTRACT:
A method of making a plug transistor is disclosed. The method includes providing a semiconductor substrate with an active region of a first conductivity type, providing a doped layer of a second conductivity type in the active region, forming a dielectric layer over the active region, forming an opening in the dielectric layer, implanting a dopant of the first conductivity type through the opening into a portion of the doped layer beneath the opening thereby counterdoping the portion of the doped layer and splitting the doped layer into source and drain regions, forming a gate insulator on the active region and in the opening, and forming a gate on the gate insulator and in the opening and adjacent to the dielectric layer. Preferably, a single photoresist layer provides an etch mask for the dielectric layer and an implant mask for the dopant. It is also preferred that the gate is formed by depositing a blanket layer of gate material over the dielectric layer and into the opening and then polishing the gate material so that the gate is aligned with a top surface of the dielectric layer. In a CMOS process, the method includes forming the gate insulators and gates for the N-channel and P-channel devices separately and in sequence, and also includes forming the sources and drains for N-channel and P-channel devices before forming the gate for the P-channel device. In this manner, the N-channel and P-channel devices can have gate insulators and/or gates with different materials and/or thicknesses, and little or no boron penetration occurs, thereby providing excellent threshold voltage control.

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