Enhancement-depletion logic based on gaas mosfets

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438285, 438308, M01L 218238, M01L 21336

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active

058720316

ABSTRACT:
The present invention discloses a method of forming an oxide layer on a layer of gallium arsenide, including the steps of depositing a layer of aluminum arsenide on the layer of gallium arsenide, of exposing the layer of aluminum arsenide to an oxidizing gas mixture so that the aluminum arsenide is oxidized to aluminum oxide, and of controlling excess arsenic released in the aluminum oxide during the exposing step, so as to ensure enhanced electrical properties in the aluminum oxide. The method is used to provide an insulating gate layer for a GaAs field effect transistor by forming an oxide layer on GaAs and controlling excess arsenic so as to maintain high resistivity in the oxide layer and to avoid the formation of interface surface states which degrade transistor performance. The method is also used to provide complementary metal-insulator-semiconductor logic devices based on the gallium arsenide field effect transistor.

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P.A. Parikh, et al., "Hydrogenation of GaAs MISFETs with AI203 as the gate insulator," Electronics Letters vol. 32, No. 18, pp. 1724-1726 (Aug. 1, 1996).

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