Method of fabricating storage capacitor for dynamic random-acces

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438398, 257309, H01L 218242

Patent

active

061401803

ABSTRACT:
A method of fabricating the storage capacitor for the memory cell units of DRAM IC devices is disclosed. The method is not constrained by the resolution limitations commonly seen in traditional photolithography. Self-aligned anisotropic procedure can be employed to form contact opening having reduced dimension. The smaller via formed in the opening can effectively prevent the situation in which the via is short-circuited with other components of the cell unit. Device fabrication yield rate can thus be improved.

REFERENCES:
patent: 5773342 (1998-06-01), Fukase
patent: 5872041 (1999-02-01), Lee et al.
patent: 5902124 (1999-05-01), Hong
patent: 5930641 (1999-07-01), Pan

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