Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma
Patent
1999-03-17
2000-10-31
Padgett, Marianne
Coating processes
Direct application of electrical, magnetic, wave, or...
Plasma
427569, 42725518, 42725523, 42725529, 42725537, 438763, 438788, 438789, 438905, H05H 124
Patent
active
06139923&
ABSTRACT:
A method and apparatus for reducing particle contamination in a substrate processing chamber during deposition of a film having at least two layers. The method of the present invention includes the steps of introducing a first process gas into a chamber to deposit a first layer of the film over a wafer at a first selected pressure, introducing a second process gas into the chamber to deposit a second layer of the film over the wafer, and between deposition of said first and second layers, maintaining pressure within the chamber at a pressure that is sufficiently high that particles dislodged by introduction of the second process do not impact the wafer.
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Applied Materials Inc.
Padgett Marianne
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