Method and apparatus for passive characterization of semiconduct

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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324754, G01R 3102

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active

061042013

ABSTRACT:
Probe structures for testing electrical interconnections to integrated circuit devices and other electronic components; particularly to testing integrated circuits devices with high density area array solder ball interconnections. The probe structure is formed from a substrated have a surface, with at least one electrical contact location having a perimeter which is raised above the surface, and a location within the boundaries of said perimeter which is raised above the surface.

REFERENCES:
patent: 4955523 (1990-09-01), Calomagno et al.
patent: 5476211 (1995-12-01), Khandros
patent: 5852871 (1998-12-01), Khandros
Moto'o Nakano, A Probe for Testing Semiconductor Integrated Circuits and a Test Method Using Said Probe, J-Tech Translations, Disclosure No.: Hei 3-69131, Mar. 25, 1991, pp. 1-10.

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