Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1999-03-26
2000-08-15
Baxter, Janet
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
4302811, 4302861, 430905, 430917, 525 73, 522 31, 522 57, G03C 173
Patent
active
061034509
ABSTRACT:
A photosensitive polymer, a dissolution inhibitor, and a chemically amplified photoresist composition containing the photosensitive polymer and the dissolution inhibitor are provided. The photosensitive polymer is a copolymer polymerized with 5-norbornene-2-methanol derivative monomer having a C.sub.1 to C.sub.20 aliphatic hydrocarbon as a side chain, and a maleic anhydride monomer. The dissolution inhibitor is a tricyclodecane derivative or a sarsasapogenin derivative, each having an acid-labile group as a functional group. The chemically amplified photoresist composition containing the photosensitive polymer and/or dissolution inhibitor has a strong resistance to etching and excellent adherence to underlying layer.
REFERENCES:
patent: 4841005 (1989-06-01), Tamaru et al.
patent: 4853315 (1989-08-01), McKean et al.
patent: 5225483 (1993-07-01), Datta et al.
patent: 5843624 (1998-12-01), Houlihan et al.
Uzodinma Okoroanyanwu et al. "Alicyclic Polymers of 193 nm Resist Applications: Synthesis and Characterization", Chem. Matters 1998, 10, 3319-3327.
Baxter Janet
Clarke Yvette M.
Lee Eugene M.
Samsung Electronics Co,. Ltd.
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