Process for cleaning an electrostatic chuck of a plasma etching

Electricity: electrical systems and devices – Electric charge generating or conducting means – Use of forces of electric charge or field

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H02N 1300

Patent

active

056711190

ABSTRACT:
A method of cleaning an electrostatic chuck, wherein a soft, particle adherent, sheet of material is affixed to a dummy wafer. The dummy wafer is then placed on the electrostatic chuck, and DC power applied to the chuck electrode to build up an electrostatic force between the chuck and wafer. After the power is turned off, the wafer and sheet of material with the adhered particle contamination is removed.

REFERENCES:
patent: 5310453 (1994-05-01), Fukasawa et al.
patent: 5382311 (1995-01-01), Ishikawa et al.
patent: 5507874 (1996-04-01), Su et al.

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