Method for the manufacture of highly heat-resistant relief struc

Details Method for the manufacture of highly heat-resistant relief struc Method for the manufacture of highly heat-resistant relief struc

1980-08-19

1982-06-01

Brammer, Jack P.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

20415914, 20415919, 430 9, 430 18, 430270, 430280, 430281, 430296, 430325, G03C 500

Patent

active

043328830

ABSTRACT:
Disclosed herein is a method for the preparation of highly heat-resistant relief structures by applying radiation-sensitive soluble polymer precursor stages in the form of a layer or a foil to a substrate; irradiating the layer or foil through negative patterns with actinic light or by deflecting a light, electron or ion beam; removing the non-irradiated layer or foil portions and, optionally, subsequently annealing, as well as to the use of the relief structures made in this manner. An object of the invention is to broaden the supply of highly heat-resistant relief structures, and for this purpose it is provided to use precursor stages of polyoxazoles in the form of addition products of olefinically unsaturated monoepoxides on hydroxyl group-containing polycondensation products of aromatic and/or heterocyclic dihydroxy diamino compounds with dicarboxylic-acid chlorides or esters. The relief structures prepared by the method according to the invention are suitable particularly for use as resists, surface coating material and insulation material.

REFERENCES:
patent: 3957512 (1976-05-01), Kleeberg et al.

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