Semiconductor physical quantity sensor device having semiconduct

Measuring and testing – Fluid pressure gauge – Diaphragm

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73726, 438 53, G01L 902

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active

059489910

ABSTRACT:
An IC chip for signal processing circuit is enclosed in a mold IC and a pressure sensitive element unit is integrally provided thereon. When the mold IC is housed in a case, the mold IC is fixed to the case under a state where ends of connector pins insert-molded to the case are electrically connected to external terminals of the mold IC. Thereby, a sensor signal is outputted from other ends of the connector pins. By integrating the IC chip for signal processing circuit in the mold IC, the IC chip for signal processing circuit can be protected against a contaminated environment at a location where the pressure sensitive element unit is arranged.

REFERENCES:
patent: 4655088 (1987-04-01), Adams
patent: 4879903 (1989-11-01), Ramsey et al.
patent: 5544529 (1996-08-01), Mitani et al.
patent: 5595939 (1997-01-01), Otake et al.

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