Semiconductor device with jumping wire

Details Semiconductor device with jumping wire Semiconductor device with jumping wire

1992-02-24

1994-11-08

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257776, 257787, 257784, H01L 2302

Patent

active

053629841

ABSTRACT:
A semiconductor device is disclosed in which connection between electrodes of a semiconductor element and/or between a plurality of semiconductor elements can be made in one package to the utmost. More particularly, electrodes of two IC chips 12a and 12b are bonded to leader leads 16a and interconnection leads 16b.sub.5 patterned on a film. Connections of the interconnection leads 16b.sub.1 and 16b.sub.2 to 16b.sub.4 and 16b.sub.3 which are impossible by the leads, are made in such a manner that pads 24b.sub.1, 24b.sub.4 and 24b.sub.2, 24b.sub.3 formed on the interconnection leads are connected correspondingly by using bonding wires as jumping wires. After the connection, the IC chips, the leads and the bonding wires are resin-sealed over an overall region encompassed by a region 27.

REFERENCES:
patent: 3971062 (1976-07-01), Merkle
patent: 4691225 (1987-09-01), Murakami et al.
patent: 5083189 (1992-01-01), Sawaya
patent: 5245215 (1993-09-01), Sawaya

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