Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface
Patent
1991-04-08
1993-07-20
McCamish, Marion E.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Forming nonplanar surface
430313, 430323, 430328, 430330, G03F 736
Patent
active
052292584
ABSTRACT:
High resolution resist structures with steep edges are obtained using standard equipment, even in cases involving critical contact-hole planes. First, a photoresist layer containing a polymer with chemically reactive groups and a photoactive component based on diazoketone or quinone diazide is deposited on a substrate. The photoresist layer is then irradiated with a patterned image and treated with a polyfunctional organic compound having functional groups that can chemically react with the reactive groups of the polymer. This step is followed by a maskless flood exposure. The photoresist layer irradiated in this manner is then treated with a metal-containing organic compound having at least one functional group capable of chemical reaction with the reactive groups of the polymer, followed by etching in an oxygen-containing plasma.
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SPIE vol. 1086: Advances in Resist Technology and Processing VI (1989), pp. 220-228.
J. Vac. Sci. Technol. B, vol. 7 (1989), pp. 1782-1786, American Vacuum Society.
Ahne Hellmut
Birkle Siegfried
Borndorfer Horst
Leuschner Rainer
Rissel Eva
McCamish Marion E.
Rodee Christopher D.
Siemens Aktiengesellschaft
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